All-Bond Universal®
All-Bond Universal is a light-cured universal adhesive suitable for direct and indirect restorations and compatible with light-, dual-, and self-cured materials. It can be used with total-, self-, or selective-etch techniques and does not require an activator. The adhesive bonds to multiple substrates and is formulated to perform under various moisture conditions.
BISCO | bisco.com
Prime&Bond active
Prime&Bond active features patented Active-Guard Technology designed to balance hydrophobic and hydrophilic properties for coverage across varying dentin moisture levels. It is compatible with all etching methods and indications, offers low film thickness, and remains usable for 30 minutes in a closed CliXdish. The formulation is free of HEMA, TGDMA, and bisphenol.
Dentsply Sirona | dentsplysirona.com
G2-BOND Universal
G2-BOND Universal is a two-component, light-cured adhesive utilizing Dual H-Technology to optimize bonding to tooth structure and composite materials. The HEMA-free formulation includes functional monomers such as 4-MET, MDP, and MDTP. It is designed to create a hydrophobic bond layer and is dispensed through an ergonomic bottle system intended to reduce waste.
GC America | gc.dental/America
Adhese® Universal
Adhese Universal is a single-component, light-cured adhesive for direct and indirect bonding procedures and all etching protocols. Delivered via the VivaPen system, it provides controlled dispensing and low film thickness. It is indicated for a wide range of applications, including restorative procedures, desensitization, sealing, and adhesive cementation without requiring an activator for dual-curing cements.
Ivoclar | ivoclar.com
OptiBond™ Universal 360
OptiBond Universal 360 is a single-component universal adhesive incorporating patented GPDM technology enriched with MDP. It is indicated for direct and indirect restorations and compatible with all etching techniques and resin cements, including use without light. The one-bottle system requires no auxiliary products and is designed for ambient temperature storage.
Kerr Dental | kerrdental.com
CLEARFIL™ Universal Bond Quick 2
CLEARFIL Universal Bond Quick 2 incorporates MDP, AMIDE, and UTM monomers to form a thin adhesive layer with no waiting time. Designed for one-step bonding, it produces a uniform, low-thickness bond layer and is stored at room temperature. The formulation aims to improve bonding layer strength while reducing pooling.
Kuraray | kuraraydental.com
Rodin® Bond Dental Adhesive System
Rodin Bond is a light-cured adhesive designed for direct and indirect applications and incorporates nano-hybrid glass filler technology. It is compatible with light-, self-, and dual-cured composites. The system may be paired with SensiGuard®, a desensitizer and primer. Packaging options include a flip-top cap and unit dose format to reduce air and moisture exposure.
Pac-Dent | pac-dent.com
Brush&Bond® MAX
Brush&Bond MAX is a single-bottle adhesive system combining etchant, adhesive, and desensitizer. It utilizes a Touch Application™ technique in which an activator brush is dipped into the liquid and applied to the preparation surface. The adhesive is compatible with all etching techniques and composite types and features low film thickness and single-coat application.
Parkell | parkell.com
BeautiBond® Xtreme
BeautiBond Xtreme is a universal bonding agent featuring Quad-Adhesive Technology for direct and indirect restorations. It requires only a single-layer application and has a 5 µm film thickness. The adhesive is compatible with light-, dual-, and self-cured materials and supports self-etch, selective-etch, and total-etch techniques. The formulation is HEMA-free.
Shofu | shofu.com
3M™ Scotchbond™ Universal Plus Adhesive
3M Scotchbond Universal Plus Adhesive is a BPA derivative-free universal adhesive indicated for all direct and indirect bonding procedures and compatible with all etching techniques. It features dentin-like radiopacity, dual- and self-cure compatibility without a separate activator, and bonds to multiple substrates without additional primers or silanes.
It is available in flip-top vial
and unit dose formats.
Solventum | solventum.com
Tokuyama Universal Bond
Tokuyama Universal Bond is a two-component universal adhesive that does not require surface agitation, light-curing, or wait time after placement. It is compatible with self-, total-, and selective-etch techniques and with light-, self-, and dual-cured composite materials. The adhesive bonds to various restorative materials without additional primers or activators.
Tokuyama | tokuyama-us.com
Peak™ Universal Bond
Peak Universal Bond is a universal adhesive indicated for direct and indirect bonding procedures, including post and core applications. It contains 7.5% filler for optimized viscosity and minimal film thickness and includes 0.2% chlorhexidine. The adhesive is available in syringe, bottle, and unit dose delivery systems.
Ultradent | ultradent.com
Futurabond U
Futurabond U is a dual-curing universal adhesive indicated for direct and indirect restorations and compatible with light-, dual-, and self-curing methacrylate-based composites. It supports self-, selective-, and total-etch techniques and adheres to materials including metal, zirconia, aluminum oxide, and silicate ceramics without additional primers. It is available in SingleDose packaging and does not require refrigeration.
VOCO | voco.dental
